For more than thirty five years TWI has been an innovation leader, first in HDD and then in the semiconductor industry. Based in Silicon Valley, we understand the major industry trends, and have devoted ourselves to customizing solutions to challenges facing our customers.
As a small company with a long history, as well as its own research and development teams and experienced engineers, TWI is able to solve a wide range of high-value problems. To find out how we can provide innovative CMP solutions for your business, please contact one of our experts here.
Learn more about TWI’s many milestones and achievements over its twenty five year history.
The First Decade at TWI
TWI is incorporated. We introduce our first cleanroom “low lint” materials, which have since become the industry standard.
TWI developed a reduced chloride Sontara 8003 disk processing tape with DuPont.
TWI begins working with Exclusive Design Company (EDC), our longtime partner, to develop a machine with the ability to polish and texture disks for storage devices. We created a textile tape that delivered a polishing or texturing slurry to the disk surfaces, ultimately selling them to most of the biggest hard disk drive manufacturers in the industry, including IBM, Komag and Akashic Memories.
TWI introduces a tape for texturing rigid disks, a product that has become especially important as the industry switched to thin film coatings, which required applying a fine finishing polish to various film layers.
Our Transition to CMP
TWI launches its innovative chemical mechanical planarization (CMP) program with its thin-film free abrasive texture tape.
TWI introduces WestPad, a new product line aimed at CMP: a softer and more porous polishing pad that allowed more efficient use of slurry than the industry norm. We also introduced Zonal Texturing Tapes for thin-film media.
TWI is invited to participate in a benchmark study of polishing pads for the use in tungsten CMP by SEMATECH, a research consortia of chipmakers partially federally funded. In that study, our pad outperformed industry standards. SEMATECH recognizes this achievement by awarding TWI a spot in another benchmark study. Our success leads to funding from six other research programs, and TWI rapidly gains market share in W CMP with our 813, and later our 711, pads, which continue to be used worldwide.
In collaboration with EDC, TWI develops textile substrates for free abrasive texturing in the Thin-Film Rigid Disk Industry. This becomes the “tool of choice” for thin-film media texturing.
TWI demonstrates its commitment to innovation by establishing its East Coast Materials Research Division.
TWI continues to grow and innovate, establishing its CMP laboratory with the Strasbaugh 6EC CMP tool as a test bench.
TWI opens a new $12-million pad and tape production facility and corporate headquarters in Sunnyvale, California.
TWI’s 813 CMP pad is selected for IPEC/SEMATECH Gaard Tool Benchmark, and our pads are still used by IPEC for tool qualification
A Decade of Rapid Progress
TWI turns its focus to the more specialized markets for polishing products and hires a team of veteran IC industry executives to ensure we continue to provide optimum service to our new customer base.
TWI’s WS21 Tape becomes industry standard for LMR texturing.
TWI’s business and quality system is certified to the ISO 9001 international quality system standard (TUV CERT# 02-1115). We have since been recertified in 2006 and 2009.
TWI obtains a Global Window License from Applied Materials.
TWI introduces microdenier nylon and poly tapes for advanced LMR texturing.
TWI unveils its successful 312 pad for W, Cu, oxide and STI CMP applications. Our 312 pad continues to be used worldwide.
TWI becomes the world’s largest supplier of CMP pads for tungsten CMP, in production on all major polishing equipment systems in Taiwan, China, Korea, Malaysia, Europe and the United States.
Recent Innovations: The PuRa product line
TWI begins development on the second generation of Polyurethan CMP pads and its new, innovative PuRa product line. The PuRa line is designed for a uniquely stable process, using electroscopes to modulate the pads’ surface topography to meet each application’s unique performance needs.